Supermicro H8DTU-F Motherboard - in new condition, 30 Day Warranty.Motherboard comes with dual Xeon E5520 ProcessorsIncludes mounting back panel I/O plane and sata cables.Motherboard specifications:Dual 1366-pin LGA SocketsSupports up to two Intel 64-bit Xeon processor(s) of the same type below:Intel XeonProcessor 5600 Series (Westmere)Intel XeonProcessor 5500 Series (Nehalem-EP)QPI up to 6.4 GT/sMemory Capacity12x 240-pin DIMM slotsSupports up to 192 GB 1XXX / XXXX / XXXMHz DDR3 ECC Registered memorySupports up to 48 GB 1XXX / XXXX / XXXMHz DDR3 ECC / Non ECC Unbuffered memoryMemory Mirroring supported1XXX / XXXX / XXXMHz ECC Registered / ECC or Non ECC Unbuffered DDR3 SDRAM 72-bit, 240-pin gold-plated DIMMsDIMM Sizes : 1GB, 2GB, 4GB , 8GB , 16GBMemory Voltage : 1.5 V / 1.35VError Detection, Corrects single-bit errors, Detects double-bit errors (using ECC memory)Supports Intel x4 and x8 Single Device Data Correction (SDDC)Chipset Intel 5520 (Tylersburg) chipsetICH10R + IOH-36DSATAIntel ICH10R SATA 3.0Gbps ControllerRAID 0, 1, 5, 10 support (Windows)RAID 0, 1, 10 support (Linux)IPMISupport for Intelligent Platform Management Interface v.2.0IPMI 2.0 with virtual media over LAN and KVM-over-LAN supportWinbond WPCM450 BMCNetwork ControllersIntel 82576 Dual-Port Gigabit Ethernet ControllerSupports 10BASE-T, 100BASE-TX, and 1000BASE-T, RJ45 outputIntel I/OAT 3 support for fast, scaleable, and reliable networkingVMDq support for better performance of virtualization1x Realtek RTL8201N PHY (dedicated IPMI)GraphicsMatrox G200eWSuper I/OWinbond 83827HF chipProcessor Information:Intel Xeon ProcessorsCode Name/ Processor formerly named Nehalem EPProcessor Number E5520Lithography 45 nmPerformance# of Cores 4# of Threads 8Processor Base Frequency 2.26 GHzMax Turbo Frequency 2.53 GHzCache 8 MB SmartCacheBus Speed 5.86 GT/s QPI# of QPI Links 2TDP 80 WVID Voltage Range 0.75V -1.35VMemory SpecificationsMax Memory Size (dependent on memory type) 144 GBMemory Types DDR3 Max # of Memory Channels 3Max Memory Bandwidth 25.6 GB/sPhysical Address Extensions 40-bitECC Memory Supported Package SpecificationsSockets Supported FCLGA1366Max CPU Configuration 2TCASE 72CPackage Size 42.5mm x 45mmProcessing Die Size 263 mm2# of Processing Die Transistors 731 millionAdvanced TechnologiesIntel Turbo Boost Technology

　　1.0Intel Hyper-Threading Technology Intel Virtualization Technology (VT-x) Intel Virtualization Technology for Directed I/O (VT-d) Intel VT-x with Extended Page Tables (EPT) Intel 64

　　Instruction SetIdle StatesEnhanced Intel SpeedStep TechnologyIntel Demand Based SwitchingUPC 0XXXXXXXXXXXX